Samsung, TSMC diverge on panel materials for advanced packaging

Amy Fan, DIGITIMES, Vyra Wu, DIGITIMES Asia Wednesday 25 December 2024 0

Credit: DIGITIMES

Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience in mobile chips, while TSMC is exploring glass panels, banking on...

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