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TSMC said to adopt larger glass substrates for FOPLP

Rebecca Kuo, Tainan; Rodney Chan, DIGITIMES Asia Wednesday 24 July 2024 0

Credit: DIGITIMES

Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that, TSMC, which originally chose a glass panel size of 515mm x 510mm,...

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