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Home Tech Semiconductors

ThinTech eyes advanced packaging opportunities

Janet Kang, Taipei; Jingyue Hsiao, DIGITIMES Asia Monday 22 July 2024 0

Credit: DIGITIMES

ThinTech Materials Technology (ThinTech) anticipates stronger performance in the second half of 2024, buoyed by warming demand for panels and the successful development of Fan-Out Panel Level Packaging (FOPLP). Following strong sales in May and June,...

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