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Tuesday 6 August 2024
China's pursuit of self-sufficiency in chipmaking equipment hurts Taiwan exports
Taiwan's chipmaking tool exports, which prioritize the market in China, have been impacted by China's increased efforts to achieve self-sufficiency in semiconductor equipment.
Monday 5 August 2024
Eyeing surging demand for AI accelerator testing, Advantest revises upward financial guidance
Advantest has significantly raised its profit forecast for the current fiscal year.
Monday 5 August 2024
US plans to heighten controls on Chinese AI; South Korean and Chinese HBM manufacturers will be directly impacted
The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...
Friday 2 August 2024
Japan pursues semiconductor leadership with additional measures
Japan has implemented additional tax incentives and other measures to vigorously pursue ambitious efforts aimed at rebuilding its semiconductor industry.
Thursday 1 August 2024
CWE, CWTC drive growth through panel-level packaging and miniLED solutions
Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level...
Wednesday 31 July 2024
ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
Tuesday 30 July 2024
China accelerates HBM production for AI, CXMT expands for self-sufficiency amid sanctions
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
Tuesday 30 July 2024
LG Innotek to enter GCS market, following Samsung and SK
Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...
Monday 29 July 2024
TSMC to start using high-NA EUV tools for A14P in 2028
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
Monday 29 July 2024
Weekly news roundup: Huawei sues MediaTek in China; YMTC head expects explosive chip demand in China
These are the most-read DIGITIMES Asia stories in the week of July 22 – July 26.
Monday 29 July 2024
Japan bets on back-end processes to resurrect chip industry, attracting investments from TSMC, Samsung, and Intel
Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...
Friday 26 July 2024
Chinese semiconductor equipment could reach advanced levels in 5-10 years, says AMEC CEO
Although China is still a long way from meeting international standards in the field of semiconductor equipment, it is entirely feasible for the country to achieve technologically...
Thursday 25 July 2024
Taiwan's NCKU achieves angstrom-scale breakthrough in semiconductor precision
The semiconductor industry, traditionally operating at the nanometer scale, is now pushing the boundary toward the even tinier "angstrom" scale (one-tenth of a nanometer) with an...
Thursday 25 July 2024
KLA sees bright future in advanced packaging and HBM, expects flat growth in China
Due to the AI-driven surge in demand for semiconductor equipment, KLA reported better-than-expected financial results. The company expects to benefit from investments in advanced...
Thursday 25 July 2024
Optical industry acquiring new factories in fear of land shortage
Players in the optical industry have been expanding factories abroad or purchasing new ones in Taiwan as demand for optical components has continued to rise from many different applications,...