CES 2013: More new multi-core chipset solutions unveiled, heating up competition

Daniel Shen, Las Vegas; Steve Shen, DIGITIMES Asia Friday 11 January 2013 0

Chipset vendors including Nvidia, Qualcomm, Samsung Electronics and ST-Ericsson have all unveiled their new multi-core solutions for mobile devices and other applications at CES 2013, heating up competition in the segment in the year, according to industry...

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