Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry sources.
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Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry sources.
