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IDMs step up deployments in GaN, SiC devices

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Friday 24 September 2021 0

Credit: DIGITIMES

IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor materials, according to industry sources.

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