ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market

Jessie Shen, DIGITIMES Asia, Taipei Wednesday 31 July 2024 0

Credit: ACM

ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to efficiently remove flux residues from chiplet structures. ACM has also...

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