SK Hynix secures US$450 million in US CHIPS Act funding for HBM memory fab

Jessie Shen, DIGITIMES Asia, Taipei Tuesday 6 August 2024 0

The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging...

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