SK Hynix's eight-year partnership with Hanmi Semiconductor is showing signs of strain after the memory chipmaker began sourcing thermal compression bonding machines from rival Hanwha Semitech, according to industry sources.
Hanmi, which has been the exclusive supplier of TC Bonders essential for high-bandwidth memory (HBM) production, has reportedly pulled all service engineers from SK Hynix's factories in an unprecedented move for the semiconductor equipment sector.
The dispute escalated in March when SK Hynix ordered 12 TC Bonders worth approximately US$29.6 million from Hanwha Semitech. Hanmi has already filed a patent infringement lawsuit against Hanwha related to the bonding technology.
Industry analysts warn the conflict could threaten South Korea's competitive edge in the HBM market, where SK Hynix holds an estimated 65% global market share. The partnership had been described as "inseparable as lips and teeth" since 2017, with Hanmi achieving record revenues of KRW558.9 billion in 2024 and operating profit margins of 46%.
SK Hynix's diversification strategy follows standard industry practice of maintaining multiple suppliers to ensure continuity and price competitiveness. Meanwhile, Hanmi is reportedly expanding its supply relationships with Micron, the world's third-largest DRAM manufacturer.
Market observers suggest the dispute may eventually resolve as both companies recognize that prolonged conflict would damage their respective market positions in a sector projected to reach KRW50 trillion by year-end.
Article edited by Jack Wu
