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TSMC showcases InFO_PoP packaging tech at Nepcon Japan 2020

Julian Ho, Tokyo; Willis Ke, DIGITIMES Asia Thursday 16 January 2020 0

Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies and memory solutions, respectively.

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