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UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow

Jessie Shen, DIGITIMES Asia, Taipei Wednesday 1 February 2023 0

Credit: DIGITIMES

United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies.

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