Wah Lee Industrial Corporation has successfully integrated its CoWoS packaging materials into the supply chain of leading semiconductor manufacturers. Shipments are expected to increase...
ASE Holdings' North American subsidiary, ISE Labs, has announced a land acquisition in Guadalajara's Axis 2 industrial park, marking its first packaging facility expansion outside...
Japan's component manufacturer Kyocera Corporation is experiencing a downturn in its semiconductor organic packaging materials business. Current demand has not met previous forecasts,...
ChipMOS Technology has embraced a cautious approach to capital expenditures for 2025 and anticipates that the demand for display driver ICs will experience a more pronounced correction...
MA-tek will launch its new lab in Hokkaido, Japan by the end of this year, well ahead of schedule, to meet increasing demand for inspection and analysis services supporting 2nm chip...
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
Chunghwa Precision Test Tech (CHPT), a developer of IC test interface solutions, experienced double-digit revenue growth on both an annual and sequential basis in October 2024 as...
Chang Wah Electromaterials (CWE), a Taiwan-based semiconductor materials distributor, has reported revenue and profit margin increases for the third quarter of 2024, driven by stronger...
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
DuPont and Zhen Ding Technology have announced the establishment of a strategic cooperation agreement in the field of advanced PCB technology. Charles Shen, chairman of Zhen Ding,...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach,...
The semiconductor packaging specialist and Yaego Group affiliate Tong Hsing Electronics reported that seasonal patterns in 2024 have differed from previous years, with revenue remaining...
