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Tuesday 2 July 2024
Taiwanese semiconductor supply chain migrates to meet customers' geopolitical risk demand
At the urging of customers and incentives provided by countries vying for domestic semiconductor production, leading companies in the Taiwanese semiconductor supply chain have accelerated...
Tuesday 2 July 2024
Policy hurdles hamper Indonesia's semiconductor ambitions in the escalating region
Southeast Asian countries are pulling out all the stops to attract semiconductor companies to set up factories in their regions. Malaysia, already a stronghold for packaging and testing,...
Friday 28 June 2024
ShunSin accelerates SiPh and CPO deployment
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in System-in-Package (SiP) modules, has accelerated the deployment of Silicon Photonics (SiPh)...
Thursday 27 June 2024
China sees bumpy road ahead for homegrown HBM development, lagging memory giants by 10 years
China's development of homegrown High Bandwidth Memory (HBM) has a long way to go, lagging behind international memory giants by 10 years.
Thursday 27 June 2024
ASEH steps up production expansion for advanced packaging
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
Thursday 27 June 2024
Equipment makers see demand boom for TSMC CoWoS packaging
With TSMC planning to boost production capacity for CoWoS packaging, related fab toolmakers are confident about orders from the contract chipmaker.
Wednesday 26 June 2024
ASE sees better prospects in 2H24, thanks to robust advanced packaging demand
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...
Wednesday 26 June 2024
Malaysia fast becoming semiconductor hub
Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.
Wednesday 26 June 2024
ASE sets up new facility in southern Taiwan for advanced packaging
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Tuesday 25 June 2024
Intel Foundry ecosystem partners add reference flows for EMIB advanced packaging
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
Tuesday 25 June 2024
AI demand driving up orders for passive components
Passive component makers have seen a marked rise in demand for new products and materials with the rise of AI servers.
Monday 24 June 2024
Innolux, OSATs stepping up FOPLP deployment
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Friday 21 June 2024
Chinese OSATs gear up for advanced packaging
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
Monday 17 June 2024
Breaking barriers: Bay Photonics thrives as key player in Silicon Photonics evolution
Energy consumption issues and the heat generated by AI training and inference computing have the semiconductor industry looking for Silicon Photonics partners such as Bay Photonics...
Tuesday 11 June 2024
Weekly news roundup: SPIL injects US$1.276 billion into Penang to build packaging, testing capacity
These are the most-read DIGITIMES Asia stories in the week of June 3 – June 7.
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research