Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 23 June 2010 0

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers have begun to replenish their inventories in preparation for the...

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