CONNECT WITH US

Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10

Ingrid Lee, Taipei; Steve Shen, DIGITIMES Asia 0

IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station substrates as growth drivers.

The article requires paid subscription. Subscribe Now