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ChipMOS seeing COF packaging capacity run at full utilization

Julian Ho, Hsinchu; Jessie Shen, DIGITIMES Asia Wednesday 27 June 2018 0

ChipMOS Technologies has seen its COF (chip-on-film) packaging production capacity run at full utilization, thanks to strong demand for TDDI (touch and display driver integration) chips for use in smartphone panels, according to company chairman SJ...

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