Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components

Taipei, Saturday, November 23, 2019 03:30 (GMT+8),

21°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Positioned as LaaS provider�GQ&A with WPG CEO Frank Yeh

Bits + chips

Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components

Julian Ho, Taipei; Jessie Shen, DIGITIMES

Friday 16 August 2019

GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter of 2019, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Taiwan semiconductor foundry sector, 2Q19
Taiwan-based semiconductor foundries showed recovery in second-quarter 2019.
Global server shipment forecast and industry analysis, 2019
For 2019, Taiwan-based server shipments will pick up another 7% on year.
Global mobile device shipment forecasts, 2019 and beyond: Smartphones, notebooks and tablets
Notebooks, smartphones and tablets are expected to see mixed shipment performances in 2019.

Digitimes Research Quarterly Data services

© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only