Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components
Julian Ho, Taipei; Jessie Shen, DIGITIMES
GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter of 2019, according to industry sources.
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.