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Burn-in test demand for Wi-Fi, HPC chips surges

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 12 May 2020 0

IC testing solution providers have recently enjoyed a ramp-up in orders for burn-in board orders for use in the manufacture of 802.11ax (Wi-Fi 6) and high-performance computing (HPC) chip solutions, according to industry sources.

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