中文網
Taipei
Thu, Oct 28, 2021
18:59
mostly clear
23°C
CONNECT WITH US
Kinsus gearing up to expand presence in FCBGA, AiP fields
Jay Liu, Taipei; Willis Ke, DIGITIMES 0

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from 5G applications in 2020, according to the IC substrate maker.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories