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ASE, Greatek see QFN wire bonding run at full capacity for PMICs

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Friday 27 November 2020 0

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand for power management ICs for 5G and 8K applications, according to...

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