Winbond starts equipment move-in at new fab in southern Taiwan

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 18 January 2022 0

Credit: DIGITIMES

Specialty DRAM and flash chipmaker Winbond Electronics has kicked off its equipment move-in at its new 12-inch wafer plant in Kaohsiung, southern Taiwan, and is targeting production starting in September, according to the company.

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