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Chip vendors gearing up for transition to 12-layer HBM memory

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 2 April 2024 0

Credit: DIGITIMES

Primary memory manufacturers are expected to encounter increased competition in the High Bandwidth Memory (HBM) industry in the second half of 2024, as manufacturing technology specs move from eight to twelve layers. This trend will significantly impact...

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