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TSMC to break ground for German fab at year-end 2024, sources say

Monica Chen, Hsinchu; Rodney Chan, DIGITIMES Asia Thursday 25 July 2024 0

Credit: AFP

TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor equipment makers.

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