SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous integration, compound semiconductors, and silicon photonics.
Under the theme "Breaking Limits: Powering the AI Era," SEMICON Taiwan will explore how semiconductor technology is driving the advent of the AI era. The exhibition will gather over 1,000 companies to showcase their latest tech solutions and innovations across 3,700 booths, setting a new record in scale and demonstrating the global high expectations and attention to semiconductor technology developments.
SK Hynix, leveraging HBM (high bandwidth memory) technology and capacity advantages to turn around its operations in recent years, will participate in the CEO Summit for the first time this year. Additionally, the exhibition will feature special zones for heterogeneous integration and materials, with major companies like Entegris, GlobalWafers, Samsung Electronics, and SK Hynix to share insights into advanced semiconductor packaging and material technologies at related summit forums.
Other renowned exhibitors include industry giants like Applied Materials, Lam Research, Tokyo Electron, KLA, Hermes-Epitek, Disco, ASMPT, Merck, Innolux, Delta Electronics, and many more.
The dedicated heterogeneous integration exhibition area will bring together key industry players from upstream, midstream, and downstream, including IC design, manufacturing, packaging, and end-system companies. This area will showcase the latest emerging technologies and applications, outlining a blueprint for the future development of the semiconductor industry.
A four-day Heterogeneous Integration Global Summit (HIGS) series will open on September 3, featuring major companies like AMD, Micron, Intel, Microsoft, Samsung, SK Hynix, and TSMC sharing their technological breakthroughs and product innovations in areas such as HBM, chiplets, and Fan-Out Panel Level Packaging (FOPLP), demonstrating the latest developments in these critical technologies.
The HIGS series will include the inaugural FOPLP Innovation Forum, where companies like ASE, Innolux, and NXP will explore the latest technological advancements. This forum aims to accelerate technological breakthroughs, advance strategic deployment, and comprehensively enhance semiconductor manufacturing capabilities.
