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Wah Lee's CoWoS enters leading supply chain; delivers FOPLP key materials samples to manufacturers

Nuying Huang, Taipei; Jack Wu, DIGITIMES Asia Monday 11 November 2024 0

Credit: DIGITIMES

Wah Lee Industrial Corporation has successfully integrated its CoWoS packaging materials into the supply chain of leading semiconductor manufacturers. Shipments are expected to increase in 2025. Additionally, samples of Fan-Out Panel Level Packaging...

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