PGC (Progate Group Corporation) has recently teamed up with North American strategic allies to meet the growing demand for advanced process technologies in AI, high-performance computing (HPC), and advanced driver-assistance systems (ADAS). By leveraging its partnerships with TSMC and ASE in advanced nodes and advanced packaging, PGC has enhanced its ASIC turnkey service for 7nm/6nm and below, as well as TSMC CoWoS solutions.
Since joining Synopsys IP OEM Program in August this year, PGC has significantly expanded its high-speed interface IP service capabilities, offering hundreds of high-quality IP solutions for advanced processes, including die-to-die, Ethernet, PCIe, MIPI, DDR, and USB. These efficient and low-risk solutions help customers shorten time-to-market while optimizing product performance, power, and area (PPA).
In addition to developments in advancing process technologies, PGC is assessing Synopsys AI-driven EDA solutions DSO.ai, which use AI technology to explore the design space for optimal PPA. The company also plans to expand its R&D design team to enhance the efficiency and quality of APR physical design service on advanced nodes. Moreover, PGC has actively participated in global semiconductor events such as TSMC OIP Ecosystem Forums in North America and Hsinchu, showcasing its technical strength and deepening industry collaborations.
With over 30 years of experience in ASIC design service, PGC has successfully collaborated with customers in Taiwan, Japan, and Israel. To meet the diverse and small-volume demands, PGC offers highly flexible and competitive ASIC Turnkey services in terms of both pricing and quantity. By strengthening its relationships with regional partners, PGC aims to deliver real-time support and cost-effective solutions to its customers.
