These are the top-read DIGITIMES Asia stories from the week of April 21 – April 27.
China reportedly plans mega-merger of chip toolmakers—from 200 players to merely 10
China is cutting more than 200 semiconductor equipment firms down to 10 core players to boost self-sufficiency and counter US sanctions under President Donald Trump. Naura Technology, ranked among the global top 10, kicked off the consolidation with a CNY1.69 billion (US$233 million) investment in Zhejiang Jingsheng.
Despite CNY1.331 trillion in spending since 2014, China's chip self-sufficiency remains just 23%. Meanwhile, manufacturers are shifting final assembly to Singapore and Malaysia to dodge US tariffs of up to 145%. SEMI forecasts global wafer fab equipment spending will hit US$123.2 billion in 2025, with China leading demand.
US$37 billion on the line: Samsung's delayed Taylor fab nears critical juncture
Samsung Electronics plans to launch its delayed Taylor, Texas fab by late 2026, missing its original US$17 billion, sub-2nm target timeline. Construction-in-progress assets hit KRW53 trillion (US$37.34 billion) by end-2024, with Samsung Austin Semiconductor's assets tripling since 2021. Delays risk losing tax breaks, CHIPS Act subsidies, and clashing with President Donald Trump's reshoring drive. With TSMC completing its 3nm Arizona fab and pushing 2nm expansion by 2025, Samsung's 4nm-based Taylor fab may need upgrades to stay competitive.
China's CXMT muscles into DRAM's top tier—Is 'Big Three' era over?
CXMT will boost DRAM output by 68% to 2.73 million wafers in 2025, nearing Micron's production and reaching 50% of SK Hynix's levels. Monthly output doubled to 200,000 wafers in early 2025, with 300,000 targeted by 2026. China's DRAM market share could climb from 5% in 2023 to 12% by late 2025, posing a direct challenge to Samsung, SK Hynix, and Micron.
AMEC CEO trades US citizenship for China's chip future
Gerald Yin, CEO of AMEC and a veteran of Intel, Lam Research, and Applied Materials, has renounced his US citizenship to reclaim Chinese nationality. His move reflects tightening US export controls that have also forced AMEC to restructure leadership, with several American executives stepping aside.
Exclusive: Google considers HBM3E supplier change
Samsung's HBM3E failed Nvidia's certification, prompting Google to reconsider its supplier and weigh a switch to Micron. Samsung's 12-layer HBM3E remains uncertified, while SK Hynix leads with strong yields and is set to capture over half of second-quarter 2025 HBM3E shipments. Meanwhile, tightening US export controls on Nvidia's H20 chips adds further pressure on Samsung, as CXMT ramps up competing HBM2 and HBM3 efforts in China.
Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron
Hanmi Semiconductor secured a second major order of about 50 thermo-compression (TC) bonders from Micron Technology, with unit prices 30–40% higher than those sold to SK Hynix due to Micron's non-conductive film (NCF) bonding approach. Tensions escalated after SK Hynix added Hanwha Semitech as a second TC bonder supplier amid ongoing patent lawsuits, leading Hanmi to pull service engineers and demand a 25–28% price hike.
TSMC Arizona could break even in 2025 despite overseas losses
TSMC's Arizona, Japan (JASM), and Germany (ESMC) fabs posted losses in 2024, with Arizona's net loss reaching NT$14.3 billion (US$447 million). DIGITIMES analyst Luke Lin projects TSMC Arizona could break even by late 2025, generating US$2.16–2.3 billion in revenue if output hits 120,000 wafers annually. TSMC's profitable Nanjing fab, which overcame similar early losses, offers a roadmap for Arizona's turnaround.
Article edited by Jack Wu
