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PTI to open new plant for panel-level packaging

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 26 September 2018 0

Powertech Technology (PTI) has started constructing a new plant at the Hsinchu Science Park, northern Taiwan, which will enter volume production using the company's fan-out panel-level packaging (FOPLP) technology in 2020, according to the backend ho...

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