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PTI remains focused on FOPLP for advanced logic ICs

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 24 April 2019 0

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out panel level packaging (FOPLP) in the era of 3D-chip stacking and other...

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