PTI fan-out panel-level packaging attracts orders for HPC chips

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 18 September 2019 0

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking applications from China- and Taiwan-based fabless firms, according...

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