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Xintec sees 12-inch wafer probing as new growth driver

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Friday 14 August 2020 0

Taiwan-based CIS and 3D sensor packaging specialist Xintec has kicked off volume production at its newly-installed 12-inch wafer probing lines since July, and expects the new business to buoy its sales performance in the second half of 2020.

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