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TSMC on track to double CoWoS capacity for AI GPU/HPC chips

Monica Chen, Taipei; Willis Ke, DIGITIMES Asia Monday 12 June 2023 0

Credit: DIGITIMES

With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing and packaging services has been fully demonstrated, and the foundry...

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