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Topco Scientific expands product offerings to CoWoS and 3D IC

Julian Ho, Taipei; Julie Chang, DIGITIMES Asia Thursday 31 August 2023 0

Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist, TSC is also taking on CoWoS and 3D IC base materials.

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