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Samsung establishes HBM development team as first major change under new DS division head

Amy Fan, Taipei; Jack Wu, DIGITIMES Asia Monday 8 July 2024 0

Credit: Samsung

Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth memory (HBM) and advanced packaging (AVP) through strategic...

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