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Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM

Jessica Tsai, Taipei; Willis Ke, DIGITIMES Asia Thursday 25 July 2024 0

Credit: DIGITIMES

As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology used in this field. Memory manufacturers Samsung Electronics and SK Hynix...

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