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FOPLP under advanced packaging spotlight after CoWoS

Janet Kang, Taipei; Judy Lin, DIGITIMES Asia Monday 22 July 2024 0

FOPLP sample. Credit: DIGITIMES

Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei emphasized in a recent earnings conference...

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