These are the most-read DIGITIMES Asia stories in the week of July 29 – August 2.
CXMT begins mass producing HBM2: China aims to reclaim AI dominance?
Industry sources claimed that China's largest DRAM manufacturer, Changxin Memory Technologies (CXMT), is constructing high bandwidth memory (HBM) production lines. South Korean companies like Samsung and SK Hynix currently dominate the HBM market.
With the US reportedly considering additional export restrictions on HBM, China urgently needs its own HBM supply chain. Sources indicated that CXMT has already introduced some equipment and may place additional orders in the second half of 2024.
Micron intros new data center SSD for AI workloads
Micron Technology has announced the release of the Micron 9550 NVMe SSD, which the company claims is the world's fastest data center SSD and an industry leader in AI workload performance and power efficiency. By integrating its own controller, NAND, DRAM, and firmware into one world-class product, Micron claimed that this solution enables class-leading performance, power efficiency, and security features for data center operators. Executives from AMD and Intel also provided quotations to support Micron's claims.
Infineon launches AI MCUs
During its Tech Day held in Taiwan, Infineon Technologies, an integrated device manufacturer (IDM), announced the release of a new PSoC Edge line of microcontroller units (MCUs) with integrated NPUs to address the growing spectrum of edge AI requirements. With this launch, Infineon joins other major IDMs such as NXP Semiconductors and Renesas Electronics in the AI MCU field. The company also stated that customers from the smart home, smart industrial, and automotive electronics industries have all shown interest in PSoC Edge products.
TSMC to start using high-NA EUV tools for A14P in 2028
According to industry sources, TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028. Instead of adopting high-NA (numerical aperture) EUV (extreme ultraviolet) tools for the first-generation A14 process, TSMC will start using them for the upgraded A14P version. With the plan, TSMC will continue to be the biggest customer of Dutch semiconductor equipment leader ASML.
China accelerates HBM production for AI, CXMT expands for self-sufficiency amid sanctions
China is ramping up its efforts to produce HBM as part of its supply chain indigenization strategy. CXMT's new HBM production lines are under construction in Beijing and Hefei, intending to produce second-generation HBM (HBM2) featuring eight-layer stacking. industry observers anticipated that China's HBM manufacturing would receive significant government backing, linking back to a CNY344 billion government fund for semiconductor development announced in May.
Apple iPhone SE4 to use OLED panels from BOE and LGD
LG Display (LGD) is expected to become the second supplier of OLED panels for Apple's budget smartphone iPhone SE4, alongside China's BOE. However, while BOE will produce and supply new panels, LGD will primarily supply panels from its inventory of previously produced standard iPhone OLED panels. The upcoming iPhone SE4, slated for release in the first half of 2025, will be the first SE series model to feature OLED panels, using the 6.1-inch OLED panels from the iPhone 13 released in 2021.
Slow EU approval delays Intel and TSMC subsidies under European Chips Act
The European Chips Act, which became effective in September 2023 and was designed to bolster Europe's semiconductor industry, has been slow to approve subsidies in Europe despite initial discussions. So far, only Italy and France have secured subsidies for STM's and GlobalFoundries' projects. This is especially frustrating for Germany, which has invited Intel and TSMC to invest billions to construct wafer foundries in Germany with the promise of subsidies.
