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G2C+ alliance expects robust demand for advanced packaging

Janet Kang, Taipei; Rodney Chan, DIGITIMES Asia Friday 30 August 2024 0

Credit: DIGITIMES

The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance formed by C Sun, Gallant Precision Machining (GPM) and Gallant...

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