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ASE set to volume produce chip-last FOCoS process in 2021

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Thursday 24 September 2020 0

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with volume production scheduled for 2021, according to industry sources.

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