SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute Express Link (CXL) memory solutions will leverage TSMC's advanced process capabilities, marking a strategic shift in high-performance memory manufacturing.
According to ETNews, SK Hynix has signed a contract valued at KRW31.1 billion(US$23.2 million) with AsicLand to design a CXL memory controller, with the agreement extending through June 30, 2026.
AsicLand, as South Korea's exclusive DSP provider within TSMC's Value Chain Aggregator (VCA) program, specializes in developing semiconductor IP optimized for TSMC's production processes, ensuring compatibility and streamlining mass production.
CXL, an interface technology built on PCIe, links CPUs, GPUs, accelerators, and other memory devices. By enabling modular memory capacity and bandwidth expansion, CXL is emerging as the next evolution in HBM technology.
Industry reports reveal that SK Hynix previously sourced memory controllers externally but has now opted to bring this function in-house through a strategic alliance with TSMC. The new generation of CXL memory, anticipated to support CXL 3.0 or 3.1 standards, will be produced using TSMC's advanced 5nm process technology, aligning with the project's development timeline.
According to the Korea Economic Daily and other sources, SK Group Chairman Tae-won Chey disclosed at the "SK AI Summit 2024" that Nvidia CEO Jensen Huang requested SK Hynix to expedite the HBM4 chip supply by six months. Chey also emphasized the critical role of SK Group's partnership with TSMC in fulfilling this request.
He explained that even the best-designed chips require robust production capabilities to be impactful. "Through close collaboration with Nvidia and TSMC, SK Group is working to provide the high-performance chips essential for advancing AI technologies," stated the Group Chairman.
In a pre-recorded message, TSMC Chairman Mark Liu recognized SK Hynix's HBM as a key element driving AI acceleration in today's data-intensive environment.
Chey recalled his previous discussions with TSMC founder Morris Chang, mentioning that more than a decade ago, he sought Chang's advice on acquiring Hynix Semiconductor. Chang strongly endorsed the acquisition and commended TSMC's deep commitment to its customers.
As SK Hynix deepens its partnerships with Nvidia and TSMC, competitive pressure mounts on Samsung Electronics. With Samsung's HBM3E product yet to receive Nvidia certification, SK Hynix's potential six-month acceleration in HBM4 mass production could significantly widen the gap between their HBM operations, potentially establishing SK Hynix as the industry leader.
In response, Chey observed that Samsung has greater technological and resource capacity than SK Hynix and, amid the AI boom, is well-positioned for strong outcomes. Without full insight into Samsung's current positioning, Chey refrained from specific competitive comments, reaffirming instead SK Hynix's focus on its objectives and commitment to producing the necessary chips on schedule and in alignment with customer demands.
