UMC, Chipbond to form partnership through share swap

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UMC, Chipbond to form partnership through share swap

Jessie Shen, DIGITIMES, Taipei Monday 6 September 2021 0

Credit: DIGITIMES

Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through a share swap.

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Categories

Bits + chips IC manufacturing

Tags

22nm 28nm AMOLED bumping Chipbond CSP DIGITIMES display driver IC foundry IC packaging partnership president semiconductor SiP strategic partnership subsidiary Taipei testing UMC venture capital

Companies

Chipbond Technology United Microelectronics Corporation

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