Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the possibility of establishing a semiconductor packaging and testing plant in Europe.
Speaking at the Quantum Taiwan Forum during SEMICON Taiwan 2024, Liu stated that Foxconn is continually planning its advanced packaging business. Following the investment in an advanced packaging plant in Qingdao, China, primarily focused on chiplet packaging, the company is seeing good progress. They now hope to expand the packaging and testing technology they have been developing to Europe.
Liu also emphasized that the relevant planning is still under evaluation. However, it is unlikely that they would only produce chips in Europe without also including packaging and testing capabilities. Regarding compound semiconductors, Foxconn Group has been continuously running R&D from silicon carbide (SiC) to silicon. In the digital domain, they have advanced to the 5nm process with promising progress.
Foxconn's services extend beyond IC design to packaging, with various units doing IC design for automotive applications. Currently, the primary focus is on the automotive sector, but future plans include expanding into the satellite industry and other sectors.
In terms of silicon photonics (SiPh) applications, Liu mentioned that the group, along with the Hon Hai Research Institute and other entities, is continuously developing SiPh technology, as well as co-packaged optics (CPO) component technology. This development aligns with the growing demand for high-speed, energy-efficient data transmission solutions in various industries, including data centers and telecommunications.
As Foxconn continues to invest in advanced semiconductor technologies and expand its global presence, the company is well-positioned to capitalize on the increasing demand for specialized chips and packaging solutions across multiple sectors. The potential establishment of a packaging and testing plant in Europe would further strengthen Foxconn's position in the global semiconductor supply chain and enable the company to better serve its European customers.
