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Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024

Janet Kang, Taipei; Rodney Chan, DIGITIMES Asia Tuesday 10 September 2024 0

Credit: DIGITIMES

A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention than the others from the equipment and materials vendors seeking to become...

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