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TSMC SoIC fab capacity to reportedly boost through to 2026

Jessie Shen, DIGITIMES Asia, Taipei Tuesday 24 September 2024 0

TSMC AP2 in Tainan Credit: Company

The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked system-on-integrated chips (SoIC) packaging is set to undergo a significant...

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