AI GPU orders max out TSMC’s CoWoS capacity; IC testing firms booked through 2026

Flora Wang, Taipei; Levi Li, DIGITIMES Asia Tuesday 25 February 2025 0

Credit: DIGITIMES

More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders to major backend packaging and testing providers, including ASE Group...

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