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Hanmi Semiconductor hikes key HBM equipment price, likely impacts SK Hynix

Lillian Chen, Taipei; Jingyue Hsiao, DIGITIMES Asia Wednesday 2 April 2025 0

Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting April 1. This marks the company's first price hike for TCB equipment,...

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