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Chipbond, ChipMOS see rising orders for TDDI chips

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Friday 25 August 2017 0

Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which will buoy their sales performance in the second half of 2017, according...

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