中文網
Taipei
Thu, Sep 23, 2021
05:17
mostly clear
27°C
CONNECT WITH US
IC substrate makers to gain from AiP modules for Apple 5G devices
Jay Liu, Taipei; Willis Ke, DIGITIMES 0

Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its mmWave antennas for 5G iPhones and 5G iPads set for launch in the second...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories