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Taiwan makers revving up to boost FC-AiP substrate yield rates

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia Wednesday 1 July 2020 0

Taiwan-based IC substrate makers continue to improve their AiP (antenna in package) substrate production yield rates seeking to gain a firm presence in AiP packaging that is expected to be widely used in mmWave-enabled 5G smartphones, according to industry...

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